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Complex electronic modules must be installed in housings as protection against the most varied ambient influences. These housings themselves have a direct influence on the extent to which the modules dissipate/absorb heat to/from the environment.
Influencing factors are • the design form, • the openness and smoothness of the
surface, • the material and • the installation density (surface area
relative to installed volume).
The arrangement of the different modules in the housing is also decisive, in order to ensure an even temperature distribution and to avoid „hot spots“.
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